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1 publication found

Use of SerDes to Reduce the Cost of Packaging of VLSIs

JM Tharinda Rangana Jayawickrama, Subramaniam Thayaparan

Conference ICIIS 2023 IEEE 17th International Conference on Industrial and Information Systems (ICIIS) , pp. 1-3 · 2023 · Cited by 0

VLSI and ASIC Design

Abstract

The escalating cost of VLSI packaging, driven by the proliferation of input and output pins and the growing design complexity, necessitates cost-effective solutions. This research paper explores a method to mitigate these costs by leveraging SerDes (Serializer/Deserializer) technology. We aim to reduce the number of I/O pins within internal chips that lack external signal requirements by employing open-source SerDes. We propose an integrated approach to incorporate SerDes into VLSI designs and validate its effectiveness through existing design cases.